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R&D projects at Solmates

R&D projects

R&D projects:

Solmates is involved in various national and international research collaborations with institutes, (SME) development partners, and industrial end-users.



The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This
covers Process Integration, creation of Lithography Equipment, EUV Mask Repair Equipment and Metrology tools
capable to deal with 3D structures, defects analysis, overlay and feature size evaluation.
Each of these objectives will be achieved by cooperation between key European equipment developers like; ASML,
Zeiss, Thermo Fisher, Applied Materials, Nova, KTI involved with their suppliers, involvement of a strong knowledge
network based on Universities of Germany, Heidelberg University Hospital, and The Netherlands, TU Delft and the
University of Twente, complemented with key Technology Institutes such as imec and Fraunhofer.

As set out in the Multi Annual Strategic Plan 2018, PIn3S addresses the ambition for the European Equipment &
Manufacturing industry for advanced semiconductor technologies to lead the world in miniaturization by supplying
new equipment and materials approximately two years ahead of introduction of volume production of advanced
semiconductor manufacturers.

Solmates will provide Hardware design for PLD equipment capable of deposition on large curved glass substrates. 
Substrate handling, temperature control and uniformity control of the deposited layer are important design challenges. 

grant agreement ID — 826422



The CUSTCO project targets the development of industrially feasible transparent conductive oxides (TCO) to reduce the cost of high efficiency silicon solar cells using full-area passivated contacts, which have demonstrated efficiencies above 25% in cleanroom and pre-production environment.

While research and industry currently focus on silicon thin films, either amorphous (a-Si:H) or silicon oxide (SiOx)/polycrystalline silicon (pc-Si) fabricated in the range of 200°C to 900°C, respectively, the CUSTCO consortium will address the significant impact of the TCO on the cost and performance improvements of such devices and hence on the success for their industrialization. In the CUSTCO project Solmates provides Pulsed Laser Deposition equipment for material evaluation for full-area passivated contacts.

Project number - SOL18001


FIVE-G: SME instrument phase 2

The project named FIVE-G (Functional Improvement & Validation of next Generation Equipment) will deliver manufacturing solutions for enhanced thin film materials enabling 5G data communication. To enable the manufacturing of these advanced materials Solmates has been awarded the SME Instrument phase 2 grant.

The next generation of mobile technology, known as 5G, offers enormous potential for businesses and the wider public as it will facilitate faster downloads, reduce latency and improve energy efficiency. These are crucial attributes to achieving the Internet of Things (IoT) and the use of mobile networks to connect and operate autonomous cars, remotely controlled industrial robots, telehealth systems and smart city infrastructure. However, the technology and ability to manufacture the RF (Radio Frequency) components that are crucial to 5Gs success are currently not at a level that would make its widespread roll out viable. To improve the functionality of RF components it is a necessity to improve the properties or to introduce more advanced thin film materials.

Within the FIVE-G project Solmates will perform process development to deliver the advanced thin film piezo materials. In addition, Solmates will perform hardware development to further mature its PLD platform to allow production of these piezo thin films.

The FIVE-G project is funded by the EU under the H2020 program (contract number: 858428).


EX3vaGaND aims to develop energy efficient electron GaN devices. The electrical power consumption is on the rise because of the increasing amount of electronics in everyday applications. As a result, there is a continuing trend to reduce the power consumption of the key component used in the power converters, the power transistor. By integrating ferroelectric materials in the transistor its power consumption will reduce. In this multidisciplinary research project, the consortium will focus on the buildup of knowledge on novel planar transistors in which a ferroelectric layer is integrated. To this purpose, we propose to develop and realize dedicated test structures in the MESA+ Nanolab and analyze those using finite-element modeling, structural analysis and electrical characterization tools.

The EX3vaGaND project started on 1 June 2018 and is funded by the NWO under the "Open Technologieprogramma" (project number: 16328). 


In CHIRON Solmates’ PZT and other piezo electrics will be used in the development of novel spin-wave computing chips. Spin-wave technology is seen as one of the potential candidates for complimenting and eventually replacing CMOS technology in future chip designs, making them smaller and more energy efficient. In CHIRON this novel way of computing, by using the interference of nanoscale magnetic waves, is used on a variety of basic logic operators. The consortium, led by imec, gathers expertise in the field of materials science, physics, manufacturing, electrical engineering, device simulation, as well as circuit design.

The CHIRON project started on the 1st of May 2018 and is funded by the Horizon 2020 FET-Open Research and Innovation Action.


Within the H2020 project 3PEAT the potential of Solmates-PZT stress-optic modulators will be further explored. 3PEAT stands for 3D Photonic integration platform based on multilayer PolyBoard and TriPleX technology for optical switching and remote sensing and ranging applications. Within the consortium of European partners, the technology of PZT actuated stress-optic modulators that was successful demonstrated for the use in 5G phased array antenna’s,
will be used for these applications. The 3PEAT project is funded by the EU under the H2020 program (contract number: 780502).


SILENSE researches acoustic technologies and develops concepts to activate and control devices by gesture, data communication, and indoor positioning, exclusively based on these innovative technologies. These concepts can be used in different domains: wearables, automotive and smart home application (IoT). In the SILENSE consortium, Solmates will develop and integrate thin film piezo materials for pMUT devices (piezo micro ultrasound transducers).

Project website:
The SILENSE project is funded by the EU under the H2020 ECSEL-JU program
(contract number: 737487)


Photonics is essential in today’s life science technology. PIX4life will mature a state of the art silicon nitride (SiN) photonics pilot line for life science applications in the visible range and pave the way to make it accessible as an enabler for product development by a broad range of industrial customers. In the project Solmates will use its PLD equipment for the integration of piezoelectric materials in the silicon photonics platform.

Project website:
The PIX4LIFE project is funded by the EU under the H2020 program
(contract number: 688519)


Solmates has developed a unique patented process for damage-free ITO deposition on OLEDs. In this project Solmates is looking into the scaling of its PLD technology to display size and the integration aspects.  

Completed projects at Solmates